AI Server
AI servers have high requirements for computational efficiency, system reliability, and long-term stable operation, and the equipment operates under continuous high heat flux conditions for extended periods. The design incorporates high thermal conductivity materials, precision structural design, and heat dissipation technologies, such as liquid cooling plates and heat exchange architectures. Through material selection and flow channel configuration, the system can be ensured to operate under high load conditions.
Liquid-cooled cold plate
In AI servers and high-performance computing (HPC) systems, liquid cooling plates need to stably and evenly channel coolant into their internal channels and maintain close contact with high-power chips such as CPUs, GPUs, and AI accelerators to quickly dissipate the high heat generated during computation.
Through consistent flow distribution and efficient heat exchange, localized overheating or excessive temperature differences are avoided, ensuring stable chip performance, system reliability, and the long-term operational needs of data centers.