Liquid-cooled cold plate
In AI server and high-performance computing (HPC) systems, liquid cooling plates need to stably and evenly guide the coolant into the internal channels. The design incorporates high thermal conductivity materials, precise structural design, and heat dissipation technologies, such as liquid cooling plates and heat exchange architectures. Through material selection and channel configuration, the system can operate under high load conditions.
Highly complex internal flow channel structure; challenging designs including thin walls, deep grooves, and complex paths; supports multi-faceted and multi-angle flow channel machining.