Shower head series
In wafer cleaning, etching, and chemical mechanical polishing (CMP) processes, the shower head nozzles need to evenly spray the chemical solution or deionized water onto the wafer surface to maintain a stable flow rate and consistent distribution, avoid localized scouring or unevenness, and ensure surface flatness and yield.
Micro-hole machining, high speed and low runout
Supports customized design of hole diameter, angle and distribution
High speed and low heat, stable batch production